From large TSVs for MEMS to nanoTSVs for backside power delivery, cost-effective process flows for these interconnects are essential for making 2.5D and 3D packages more feasible. Through-silicon vias ...

Researchers from the Hong Kong University of Science and Technology, Southern University of Science and Technology, and the Suzhou Institute of Nanotechnology developed an aluminum gallium nitride ...

A new technical paper titled “Open-Source Heterogeneous SoCs for AI: The PULP Platform Experience” was published by researchers at University of Bologna. “Since 2013, the PULP (Parallel Ultra-Low ...

ECUs that are designed today need to have the performance and flexibility to run the workloads of the next decade.

The international standard has been proven effective in automotive functional safety and has begun to spread to other markets ...

Global semi sales; 3rd CHIPS Act flagship; UFS and memory standards; Chinese military companies in U.S.; TSVs; CES; 18 new ...

At Rambus, we often receive RFIs, RFPs and RFQs for security silicon IP cores to be used in our customer’s next semiconductor ...

SDVs are booming, but designing hardware that can run software updates a decade in the future is a huge challenge.

The fourth quarter of 2024 saw five mega-rounds of over $100 million. One of the hottest areas continues to be AI hardware, ...

Winter sports equipment aerodynamics: If winter sports excite you, consider simulating the aerodynamics of a bobsled, ...

To tackle these reliability challenges, IC designers are increasingly embracing a “shift-left” mindset, where reliability ...

Security is beginning to improve for a wide range of IoT and edge devices due to better tools, the implementation of new standards and methodologies, and an increasing level of collaboration and ...